Electrospinning of thermal interface materials.

Xiao X, Xie B, Ouyang L, Yang J, Li C, Zhao J, Lv Y, Zeng X, Li C

DOI: 10.1016/j.cis.2025.103754
Published: 2026 Mar
Container: Advances in colloid and interface science
Publisher: Not recorded
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1016/j.cis.2025.103754,
  title = {Electrospinning of thermal interface materials.},
  author = {Xiao X and Xie B and Ouyang L and Yang J and Li C and Zhao J and Lv Y and Zeng X and Li C},
  year = {2026},
  journal = {Advances in colloid and interface science},
  doi = {10.1016/j.cis.2025.103754},
  url = {https://doi.org/10.1016/j.cis.2025.103754}
}

RIS

TY  - JOUR
TI  - Electrospinning of thermal interface materials.
AU  - Xiao X
AU  - Xie B
AU  - Ouyang L
AU  - Yang J
AU  - Li C
AU  - Zhao J
AU  - Lv Y
AU  - Zeng X
AU  - Li C
PY  - 2026
JO  - Advances in colloid and interface science
DO  - 10.1016/j.cis.2025.103754
UR  - https://doi.org/10.1016/j.cis.2025.103754
ER  -

APA

X, X., B, X., L, O., J, Y., C, L., J, Z., Y, L., X, Z., & C, L. (2026). Electrospinning of thermal interface materials.. Advances in colloid and interface science. https://doi.org/10.1016/j.cis.2025.103754

Source records

pubmed · retrieved 2026-11-10T10:02:33.246Z