Wetting interfaces for boiling heat transfer enhancement: A review of dynamic mechanisms and design strategies.

Du Z, Su Z, Zhou T, Tian P, Yang J, Deng J, He L

Open source

DOI
10.1016/j.cis.2026.104047
Published
2026 Sep 9
Container
Advances in colloid and interface science
Publisher
Not recorded
Open access
unknown

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BibTeX

@article{allodium:10.1016/j.cis.2026.104047,
  title = {Wetting interfaces for boiling heat transfer enhancement: A review of dynamic mechanisms and design strategies.},
  author = {Du Z and Su Z and Zhou T and Tian P and Yang J and Deng J and He L},
  year = {2026},
  journal = {Advances in colloid and interface science},
  doi = {10.1016/j.cis.2026.104047},
  url = {https://doi.org/10.1016/j.cis.2026.104047}
}

RIS

TY  - JOUR
TI  - Wetting interfaces for boiling heat transfer enhancement: A review of dynamic mechanisms and design strategies.
AU  - Du Z
AU  - Su Z
AU  - Zhou T
AU  - Tian P
AU  - Yang J
AU  - Deng J
AU  - He L
PY  - 2026
JO  - Advances in colloid and interface science
DO  - 10.1016/j.cis.2026.104047
UR  - https://doi.org/10.1016/j.cis.2026.104047
ER  - 

APA

Z, D., Z, S., T, Z., P, T., J, Y., J, D., & L, H. (2026). Wetting interfaces for boiling heat transfer enhancement: A review of dynamic mechanisms and design strategies.. Advances in colloid and interface science. https://doi.org/10.1016/j.cis.2026.104047

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