Embedding versus adhesive bonding of adapted piezoceramic modules for function-integrative thermoplastic composite structures
- DOI
- 10.1016/j.compscitech.2011.03.019
- Published
- 2011-05-18
- Container
- Composites Science and Technology
- Publisher
- Not recorded
- Open access
- yes
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Cite this work
BibTeX
@article{allodium:10.1016/j.compscitech.2011.03.019,
title = {Embedding versus adhesive bonding of adapted piezoceramic modules for function-integrative thermoplastic composite structures},
author = {Werner Hufenbach and Maik Gude and Thomas Heber},
year = {2011},
journal = {Composites Science and Technology},
doi = {10.1016/j.compscitech.2011.03.019},
url = {https://doi.org/10.1016/j.compscitech.2011.03.019}
}RIS
TY - JOUR TI - Embedding versus adhesive bonding of adapted piezoceramic modules for function-integrative thermoplastic composite structures AU - Werner Hufenbach AU - Maik Gude AU - Thomas Heber PY - 2011 JO - Composites Science and Technology DO - 10.1016/j.compscitech.2011.03.019 UR - https://doi.org/10.1016/j.compscitech.2011.03.019 ER -
APA
Hufenbach, W., Gude, M., & Heber, T. (2011). Embedding versus adhesive bonding of adapted piezoceramic modules for function-integrative thermoplastic composite structures. Composites Science and Technology. https://doi.org/10.1016/j.compscitech.2011.03.019
Source records
- hal · retrieved 2026-09-25T03:38:28.045Z