Low-temperature low-cost 58 Bismuth – 42 Tin alloy forensic chip re-balling and re-soldering
- DOI
- 10.1016/j.diin.2016.10.003
- Published
- 2016-12
- Container
- Digital Investigation
- Publisher
- Not recorded
- Open access
- no
Credibility signals
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Cite this work
BibTeX
@article{allodium:10.1016/j.diin.2016.10.003,
title = {Low-temperature low-cost 58 Bismuth – 42 Tin alloy forensic chip re-balling and re-soldering},
author = {Thibaut Heckmann and Th. Heckmann and Th. Souvignet and S. Lepeer and D. Naccache},
year = {2016},
journal = {Digital Investigation},
doi = {10.1016/j.diin.2016.10.003},
url = {https://doi.org/10.1016/j.diin.2016.10.003}
}RIS
TY - JOUR TI - Low-temperature low-cost 58 Bismuth – 42 Tin alloy forensic chip re-balling and re-soldering AU - Thibaut Heckmann AU - Th. Heckmann AU - Th. Souvignet AU - S. Lepeer AU - D. Naccache PY - 2016 JO - Digital Investigation DO - 10.1016/j.diin.2016.10.003 UR - https://doi.org/10.1016/j.diin.2016.10.003 ER -
APA
Heckmann, T., Heckmann, T., Souvignet, T., Lepeer, S., & Naccache, D. (2016). Low-temperature low-cost 58 Bismuth – 42 Tin alloy forensic chip re-balling and re-soldering. Digital Investigation. https://doi.org/10.1016/j.diin.2016.10.003
Source records
- hal · retrieved 2026-09-26T17:55:18.991Z