HfO<sub>2</sub>-based ferroelectric thin film and memory device applications in the post-Moore era: A review.

Liao J, Dai S, Peng RC, Yang J, Zeng B, Liao M, Zhou Y.

Open source

DOI
10.1016/j.fmre.2023.02.010
Published
2023-03-02
Container
Fundam Res
Publisher
Not recorded
Open access
yes

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BibTeX

@article{allodium:10.1016/j.fmre.2023.02.010,
  title = {HfO<sub>2</sub>-based ferroelectric thin film and memory device applications in the post-Moore era: A review.},
  author = {Liao J and  Dai S and  Peng RC and  Yang J and  Zeng B and  Liao M and  Zhou Y.},
  year = {2023},
  journal = {Fundam Res},
  doi = {10.1016/j.fmre.2023.02.010},
  url = {https://doi.org/10.1016/j.fmre.2023.02.010}
}

RIS

TY  - JOUR
TI  - HfO<sub>2</sub>-based ferroelectric thin film and memory device applications in the post-Moore era: A review.
AU  - Liao J
AU  -  Dai S
AU  -  Peng RC
AU  -  Yang J
AU  -  Zeng B
AU  -  Liao M
AU  -  Zhou Y.
PY  - 2023
JO  - Fundam Res
DO  - 10.1016/j.fmre.2023.02.010
UR  - https://doi.org/10.1016/j.fmre.2023.02.010
ER  - 

APA

J, L., S, D., RC, P., J, Y., B, Z., M, L., & Y., Z. (2023). HfO<sub>2</sub>-based ferroelectric thin film and memory device applications in the post-Moore era: A review.. Fundam Res. https://doi.org/10.1016/j.fmre.2023.02.010

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