Low temperature soldering technology based on superhydrophobic copper microlayer.

Xiao J, Zhai Q, Cheng W

DOI: 10.1016/j.heliyon.2024.e28393
Published: 2024 Apr 15
Container: Heliyon
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1016/j.heliyon.2024.e28393,
  title = {Low temperature soldering technology based on superhydrophobic copper microlayer.},
  author = {Xiao J and Zhai Q and Cheng W},
  year = {2024},
  journal = {Heliyon},
  doi = {10.1016/j.heliyon.2024.e28393},
  url = {https://doi.org/10.1016/j.heliyon.2024.e28393}
}

RIS

TY  - JOUR
TI  - Low temperature soldering technology based on superhydrophobic copper microlayer.
AU  - Xiao J
AU  - Zhai Q
AU  - Cheng W
PY  - 2024
JO  - Heliyon
DO  - 10.1016/j.heliyon.2024.e28393
UR  - https://doi.org/10.1016/j.heliyon.2024.e28393
ER  -

APA

J, X., Q, Z., & W, C. (2024). Low temperature soldering technology based on superhydrophobic copper microlayer.. Heliyon. https://doi.org/10.1016/j.heliyon.2024.e28393

Source records

pubmed · retrieved 2026-09-25T21:50:05.936Z