WITHDRAWN: On modelling the behaviour of a ductile adhesive under low temperatures

J.Y. Cognard, C. Badulescu, J. Maurice, R. Créac’hcadec, N. Carrère, P. Vedrine

DOI: 10.1016/j.ijadhadh.2013.09.014
Published: 2014-01
Container: International Journal of Adhesion and Adhesives
Publisher: Elsevier BV
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1016/j.ijadhadh.2013.09.014,
  title = {WITHDRAWN: On modelling the behaviour of a ductile adhesive under low temperatures},
  author = {J.Y. Cognard and C. Badulescu and J. Maurice and R. Créac’hcadec and N. Carrère and P. Vedrine},
  year = {2014},
  journal = {International Journal of Adhesion and Adhesives},
  doi = {10.1016/j.ijadhadh.2013.09.014},
  url = {https://doi.org/10.1016/j.ijadhadh.2013.09.014}
}

RIS

TY  - JOUR
TI  - WITHDRAWN: On modelling the behaviour of a ductile adhesive under low temperatures
AU  - J.Y. Cognard
AU  - C. Badulescu
AU  - J. Maurice
AU  - R. Créac’hcadec
AU  - N. Carrère
AU  - P. Vedrine
PY  - 2014
JO  - International Journal of Adhesion and Adhesives
DO  - 10.1016/j.ijadhadh.2013.09.014
UR  - https://doi.org/10.1016/j.ijadhadh.2013.09.014
ER  -

APA

Cognard, J., Badulescu, C., Maurice, J., Créac’hcadec, R., Carrère, N., & Vedrine, P. (2014). WITHDRAWN: On modelling the behaviour of a ductile adhesive under low temperatures. International Journal of Adhesion and Adhesives. https://doi.org/10.1016/j.ijadhadh.2013.09.014

Source records

crossref · retrieved 2026-09-25T19:40:12.511Z