The reaction pathway of Ti–SiC system in Cu melts
- DOI
- 10.1016/j.jallcom.2019.152860
- Published
- 2020-03
- Container
- Journal of Alloys and Compounds
- Publisher
- Not recorded
- Open access
- no
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Cite this work
BibTeX
@article{allodium:10.1016/j.jallcom.2019.152860,
title = {The reaction pathway of Ti–SiC system in Cu melts},
author = {Haimin Ding and Wenzhi Miao and Weiwen Chu and Qing Liu and Jinfeng Wang and Kaiyu Chu and Nicolas Glandut and Chong Li},
year = {2020},
journal = {Journal of Alloys and Compounds},
doi = {10.1016/j.jallcom.2019.152860},
url = {https://doi.org/10.1016/j.jallcom.2019.152860}
}RIS
TY - JOUR TI - The reaction pathway of Ti–SiC system in Cu melts AU - Haimin Ding AU - Wenzhi Miao AU - Weiwen Chu AU - Qing Liu AU - Jinfeng Wang AU - Kaiyu Chu AU - Nicolas Glandut AU - Chong Li PY - 2020 JO - Journal of Alloys and Compounds DO - 10.1016/j.jallcom.2019.152860 UR - https://doi.org/10.1016/j.jallcom.2019.152860 ER -
APA
Ding, H., Miao, W., Chu, W., Liu, Q., Wang, J., Chu, K., Glandut, N., & Li, C. (2020). The reaction pathway of Ti–SiC system in Cu melts. Journal of Alloys and Compounds. https://doi.org/10.1016/j.jallcom.2019.152860
Source records
- hal · retrieved 2026-09-26T11:22:47.349Z