The reaction pathway of Ti–SiC system in Cu melts

Haimin Ding, Wenzhi Miao, Weiwen Chu, Qing Liu, Jinfeng Wang, Kaiyu Chu, Nicolas Glandut, Chong Li

Open source

DOI
10.1016/j.jallcom.2019.152860
Published
2020-03
Container
Journal of Alloys and Compounds
Publisher
Not recorded
Open access
no

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BibTeX

@article{allodium:10.1016/j.jallcom.2019.152860,
  title = {The reaction pathway of Ti–SiC system in Cu melts},
  author = {Haimin Ding and Wenzhi Miao and Weiwen Chu and Qing Liu and Jinfeng Wang and Kaiyu Chu and Nicolas Glandut and Chong Li},
  year = {2020},
  journal = {Journal of Alloys and Compounds},
  doi = {10.1016/j.jallcom.2019.152860},
  url = {https://doi.org/10.1016/j.jallcom.2019.152860}
}

RIS

TY  - JOUR
TI  - The reaction pathway of Ti–SiC system in Cu melts
AU  - Haimin Ding
AU  - Wenzhi Miao
AU  - Weiwen Chu
AU  - Qing Liu
AU  - Jinfeng Wang
AU  - Kaiyu Chu
AU  - Nicolas Glandut
AU  - Chong Li
PY  - 2020
JO  - Journal of Alloys and Compounds
DO  - 10.1016/j.jallcom.2019.152860
UR  - https://doi.org/10.1016/j.jallcom.2019.152860
ER  - 

APA

Ding, H., Miao, W., Chu, W., Liu, Q., Wang, J., Chu, K., Glandut, N., & Li, C. (2020). The reaction pathway of Ti–SiC system in Cu melts. Journal of Alloys and Compounds. https://doi.org/10.1016/j.jallcom.2019.152860

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