Improving interfacial thermal transport in silicon-reinforced epoxy resin composites with self-assembled monolayers.

Sun F, Wu Q, Fu Y, Zheng L, Zheng K, Yang M, Feng Y

DOI: 10.1016/j.jcis.2024.11.184
Published: 2025 Mar
Container: Journal of colloid and interface science
Publisher: Not recorded
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1016/j.jcis.2024.11.184,
  title = {Improving interfacial thermal transport in silicon-reinforced epoxy resin composites with self-assembled monolayers.},
  author = {Sun F and Wu Q and Fu Y and Zheng L and Zheng K and Yang M and Feng Y},
  year = {2025},
  journal = {Journal of colloid and interface science},
  doi = {10.1016/j.jcis.2024.11.184},
  url = {https://doi.org/10.1016/j.jcis.2024.11.184}
}

RIS

TY  - JOUR
TI  - Improving interfacial thermal transport in silicon-reinforced epoxy resin composites with self-assembled monolayers.
AU  - Sun F
AU  - Wu Q
AU  - Fu Y
AU  - Zheng L
AU  - Zheng K
AU  - Yang M
AU  - Feng Y
PY  - 2025
JO  - Journal of colloid and interface science
DO  - 10.1016/j.jcis.2024.11.184
UR  - https://doi.org/10.1016/j.jcis.2024.11.184
ER  -

APA

F, S., Q, W., Y, F., L, Z., K, Z., M, Y., & Y, F. (2025). Improving interfacial thermal transport in silicon-reinforced epoxy resin composites with self-assembled monolayers.. Journal of colloid and interface science. https://doi.org/10.1016/j.jcis.2024.11.184

Source records

pubmed · retrieved 2026-09-26T07:55:12.532Z