Hydrogen bond engineering for defect passivation and performance enhancement in the one-dimensional copper-based perovskite-like halide
- DOI
- 10.1016/j.jcis.2026.140892
- Published
- 2026-11
- Container
- Journal of Colloid and Interface Science
- Publisher
- Elsevier BV
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1016/j.jcis.2026.140892,
title = {Hydrogen bond engineering for defect passivation and performance enhancement in the one-dimensional copper-based perovskite-like halide},
author = {Jiansen Wen and Sencan Chen and Linqin Jiang and Ping Li and Hao Xiong and Baisheng Sa and Jiansheng Li and Lingyan Lin and Yu Qiu},
year = {2026},
journal = {Journal of Colloid and Interface Science},
doi = {10.1016/j.jcis.2026.140892},
url = {https://doi.org/10.1016/j.jcis.2026.140892}
}RIS
TY - JOUR TI - Hydrogen bond engineering for defect passivation and performance enhancement in the one-dimensional copper-based perovskite-like halide AU - Jiansen Wen AU - Sencan Chen AU - Linqin Jiang AU - Ping Li AU - Hao Xiong AU - Baisheng Sa AU - Jiansheng Li AU - Lingyan Lin AU - Yu Qiu PY - 2026 JO - Journal of Colloid and Interface Science DO - 10.1016/j.jcis.2026.140892 UR - https://doi.org/10.1016/j.jcis.2026.140892 ER -
APA
Wen, J., Chen, S., Jiang, L., Li, P., Xiong, H., Sa, B., Li, J., Lin, L., & Qiu, Y. (2026). Hydrogen bond engineering for defect passivation and performance enhancement in the one-dimensional copper-based perovskite-like halide. Journal of Colloid and Interface Science. https://doi.org/10.1016/j.jcis.2026.140892
Source records
- crossref · retrieved 2026-09-26T03:02:29.361Z