Tough hydrogels featuring low young's modulus and low mechanical hysteresis toward high-performance strain sensors.

Li J, Bai Z, Li S, Yang L, Yang K, Wang Q, Cui J, Fang Y

Open source

DOI
10.1016/j.jcis.2026.141605
Published
2026 Sep 15
Container
Journal of colloid and interface science
Publisher
Not recorded
Open access
no

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BibTeX

@article{allodium:10.1016/j.jcis.2026.141605,
  title = {Tough hydrogels featuring low young's modulus and low mechanical hysteresis toward high-performance strain sensors.},
  author = {Li J and Bai Z and Li S and Yang L and Yang K and Wang Q and Cui J and Fang Y},
  year = {2026},
  journal = {Journal of colloid and interface science},
  doi = {10.1016/j.jcis.2026.141605},
  url = {https://doi.org/10.1016/j.jcis.2026.141605}
}

RIS

TY  - JOUR
TI  - Tough hydrogels featuring low young's modulus and low mechanical hysteresis toward high-performance strain sensors.
AU  - Li J
AU  - Bai Z
AU  - Li S
AU  - Yang L
AU  - Yang K
AU  - Wang Q
AU  - Cui J
AU  - Fang Y
PY  - 2026
JO  - Journal of colloid and interface science
DO  - 10.1016/j.jcis.2026.141605
UR  - https://doi.org/10.1016/j.jcis.2026.141605
ER  - 

APA

J, L., Z, B., S, L., L, Y., K, Y., Q, W., J, C., & Y, F. (2026). Tough hydrogels featuring low young's modulus and low mechanical hysteresis toward high-performance strain sensors.. Journal of colloid and interface science. https://doi.org/10.1016/j.jcis.2026.141605

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