Preferential growth of intermetallics under temperature gradient at Cu–Sn interface during transient liquid phase bonding: insights from phase field simulation
- DOI
- 10.1016/j.jmrt.2022.05.047
- Published
- 2022-07
- Container
- Journal of Materials Research and Technology
- Publisher
- Elsevier BV
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1016/j.jmrt.2022.05.047,
title = {Preferential growth of intermetallics under temperature gradient at Cu–Sn interface during transient liquid phase bonding: insights from phase field simulation},
author = {Shuibao Liang and Anil Kunwar and Changqing Liu and Han Jiang and Zhaoxia Zhou},
year = {2022},
journal = {Journal of Materials Research and Technology},
doi = {10.1016/j.jmrt.2022.05.047},
url = {https://doi.org/10.1016/j.jmrt.2022.05.047}
}RIS
TY - JOUR TI - Preferential growth of intermetallics under temperature gradient at Cu–Sn interface during transient liquid phase bonding: insights from phase field simulation AU - Shuibao Liang AU - Anil Kunwar AU - Changqing Liu AU - Han Jiang AU - Zhaoxia Zhou PY - 2022 JO - Journal of Materials Research and Technology DO - 10.1016/j.jmrt.2022.05.047 UR - https://doi.org/10.1016/j.jmrt.2022.05.047 ER -
APA
Liang, S., Kunwar, A., Liu, C., Jiang, H., & Zhou, Z. (2022). Preferential growth of intermetallics under temperature gradient at Cu–Sn interface during transient liquid phase bonding: insights from phase field simulation. Journal of Materials Research and Technology. https://doi.org/10.1016/j.jmrt.2022.05.047
Source records
- crossref · retrieved 2026-09-25T22:12:38.874Z