Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging
- DOI
- 10.1016/j.matdes.2024.112702
- Published
- 2024-02
- Container
- Materials & Design
- Publisher
- Elsevier BV
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1016/j.matdes.2024.112702,
title = {Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging},
author = {Wei Chen and Xu Liu and Dong Hu and Xu Liu and Xi Zhu and Xuejun Fan and Guoqi Zhang and Jiajie Fan},
year = {2024},
journal = {Materials \& Design},
doi = {10.1016/j.matdes.2024.112702},
url = {https://doi.org/10.1016/j.matdes.2024.112702}
}RIS
TY - JOUR TI - Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging AU - Wei Chen AU - Xu Liu AU - Dong Hu AU - Xu Liu AU - Xi Zhu AU - Xuejun Fan AU - Guoqi Zhang AU - Jiajie Fan PY - 2024 JO - Materials & Design DO - 10.1016/j.matdes.2024.112702 UR - https://doi.org/10.1016/j.matdes.2024.112702 ER -
APA
Chen, W., Liu, X., Hu, D., Liu, X., Zhu, X., Fan, X., Zhang, G., & Fan, J. (2024). Unraveling the hydrogen sulfide aging mechanism on electrical-thermal–mechanical property degradation of sintered nanocopper interconnects used in power electronics packaging. Materials & Design. https://doi.org/10.1016/j.matdes.2024.112702
Source records
- crossref · retrieved 2026-09-25T19:51:55.057Z