Structurally architected perforated dielectric substrate via stereolithography 3D printing for low-loss angle-selective surfaces
- DOI
- 10.1016/j.matdes.2026.116912
- Published
- 2026-10
- Container
- Materials & Design
- Publisher
- Elsevier BV
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1016/j.matdes.2026.116912,
title = {Structurally architected perforated dielectric substrate via stereolithography 3D printing for low-loss angle-selective surfaces},
author = {Seongbin Shin and Daecheon Lim and Kyounghwan Kim and Jinwoo Ho and Minjae Lee and Sungjoon Lim},
year = {2026},
journal = {Materials \& Design},
doi = {10.1016/j.matdes.2026.116912},
url = {https://doi.org/10.1016/j.matdes.2026.116912}
}RIS
TY - JOUR TI - Structurally architected perforated dielectric substrate via stereolithography 3D printing for low-loss angle-selective surfaces AU - Seongbin Shin AU - Daecheon Lim AU - Kyounghwan Kim AU - Jinwoo Ho AU - Minjae Lee AU - Sungjoon Lim PY - 2026 JO - Materials & Design DO - 10.1016/j.matdes.2026.116912 UR - https://doi.org/10.1016/j.matdes.2026.116912 ER -
APA
Shin, S., Lim, D., Kim, K., Ho, J., Lee, M., & Lim, S. (2026). Structurally architected perforated dielectric substrate via stereolithography 3D printing for low-loss angle-selective surfaces. Materials & Design. https://doi.org/10.1016/j.matdes.2026.116912
Source records
- crossref · retrieved 2026-11-08T11:22:25.211Z