Manipulating adsorbate configurations in copper electroplated low aspect-ratio via fill in redistribution layers

Zhenjia Peng, Zhe Li, Yu Jiao, Ning Zhang, Qi Zhang, Binbin Zhou, Liyin Gao, Xianzhu Fu, Zhiquan Liu, Rong Sun

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DOI: 10.1016/j.nanoms.2024.07.001
Published: 08
Container: Nano Materials Science
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1016/j.nanoms.2024.07.001,
  title = {Manipulating adsorbate configurations in copper electroplated low aspect-ratio via fill in redistribution layers},
  author = {Zhenjia Peng and Zhe Li and Yu Jiao and Ning Zhang and Qi Zhang and Binbin Zhou and Liyin Gao and Xianzhu Fu and Zhiquan Liu and Rong Sun},
  year = {2025},
  journal = {Nano Materials Science},
  doi = {10.1016/j.nanoms.2024.07.001},
  url = {https://doi.org/10.1016/j.nanoms.2024.07.001}
}

RIS

TY  - JOUR
TI  - Manipulating adsorbate configurations in copper electroplated low aspect-ratio via fill in redistribution layers
AU  - Zhenjia Peng
AU  - Zhe Li
AU  - Yu Jiao
AU  - Ning Zhang
AU  - Qi Zhang
AU  - Binbin Zhou
AU  - Liyin Gao
AU  - Xianzhu Fu
AU  - Zhiquan Liu
AU  - Rong Sun
PY  - 2025
JO  - Nano Materials Science
DO  - 10.1016/j.nanoms.2024.07.001
UR  - https://doi.org/10.1016/j.nanoms.2024.07.001
ER  -

APA

Peng, Z., Li, Z., Jiao, Y., Zhang, N., Zhang, Q., Zhou, B., Gao, L., Fu, X., Liu, Z., & Sun, R. (2025). Manipulating adsorbate configurations in copper electroplated low aspect-ratio via fill in redistribution layers. Nano Materials Science. https://doi.org/10.1016/j.nanoms.2024.07.001

Source records

doaj · retrieved 2026-09-25T18:56:13.035Z