Layout effects on the thermal metrics of multichannel FinFETs

Lisa Tondelli, Andries J. Scholten, Thanh Viet Dinh, Luca Selmi

Open source

DOI
10.1016/j.sse.2025.109229
Published
2025-12
Container
Solid-State Electronics
Publisher
Elsevier BV
Open access
unknown

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BibTeX

@article{allodium:10.1016/j.sse.2025.109229,
  title = {Layout effects on the thermal metrics of multichannel FinFETs},
  author = {Lisa Tondelli and Andries J. Scholten and Thanh Viet Dinh and Luca Selmi},
  year = {2025},
  journal = {Solid-State Electronics},
  doi = {10.1016/j.sse.2025.109229},
  url = {https://doi.org/10.1016/j.sse.2025.109229}
}

RIS

TY  - JOUR
TI  - Layout effects on the thermal metrics of multichannel FinFETs
AU  - Lisa Tondelli
AU  - Andries J. Scholten
AU  - Thanh Viet Dinh
AU  - Luca Selmi
PY  - 2025
JO  - Solid-State Electronics
DO  - 10.1016/j.sse.2025.109229
UR  - https://doi.org/10.1016/j.sse.2025.109229
ER  - 

APA

Tondelli, L., Scholten, A. J., Dinh, T. V., & Selmi, L. (2025). Layout effects on the thermal metrics of multichannel FinFETs. Solid-State Electronics. https://doi.org/10.1016/j.sse.2025.109229

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