Seed-free deposition of large-area adhesive diamond films on copper surfaces processed and patterned by femtosecond lasers

Lisha Fan, Yun Shen Zhou, Meng Meng Wang, Jean-François Silvain, Yong Feng Lu

Open source

DOI
10.1016/j.tsf.2017.06.058
Published
2017-08
Container
Thin Solid Films
Publisher
Elsevier BV
Open access
unknown

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BibTeX

@article{allodium:10.1016/j.tsf.2017.06.058,
  title = {Seed-free deposition of large-area adhesive diamond films on copper surfaces processed and patterned by femtosecond lasers},
  author = {Lisha Fan and Yun Shen Zhou and Meng Meng Wang and Jean-François Silvain and Yong Feng Lu},
  year = {2017},
  journal = {Thin Solid Films},
  doi = {10.1016/j.tsf.2017.06.058},
  url = {https://doi.org/10.1016/j.tsf.2017.06.058}
}

RIS

TY  - JOUR
TI  - Seed-free deposition of large-area adhesive diamond films on copper surfaces processed and patterned by femtosecond lasers
AU  - Lisha Fan
AU  - Yun Shen Zhou
AU  - Meng Meng Wang
AU  - Jean-François Silvain
AU  - Yong Feng Lu
PY  - 2017
JO  - Thin Solid Films
DO  - 10.1016/j.tsf.2017.06.058
UR  - https://doi.org/10.1016/j.tsf.2017.06.058
ER  - 

APA

Fan, L., Zhou, Y. S., Wang, M. M., Silvain, J., & Lu, Y. F. (2017). Seed-free deposition of large-area adhesive diamond films on copper surfaces processed and patterned by femtosecond lasers. Thin Solid Films. https://doi.org/10.1016/j.tsf.2017.06.058

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