Seed-free deposition of large-area adhesive diamond films on copper surfaces processed and patterned by femtosecond lasers
- DOI
- 10.1016/j.tsf.2017.06.058
- Published
- 2017-08
- Container
- Thin Solid Films
- Publisher
- Elsevier BV
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1016/j.tsf.2017.06.058,
title = {Seed-free deposition of large-area adhesive diamond films on copper surfaces processed and patterned by femtosecond lasers},
author = {Lisha Fan and Yun Shen Zhou and Meng Meng Wang and Jean-François Silvain and Yong Feng Lu},
year = {2017},
journal = {Thin Solid Films},
doi = {10.1016/j.tsf.2017.06.058},
url = {https://doi.org/10.1016/j.tsf.2017.06.058}
}RIS
TY - JOUR TI - Seed-free deposition of large-area adhesive diamond films on copper surfaces processed and patterned by femtosecond lasers AU - Lisha Fan AU - Yun Shen Zhou AU - Meng Meng Wang AU - Jean-François Silvain AU - Yong Feng Lu PY - 2017 JO - Thin Solid Films DO - 10.1016/j.tsf.2017.06.058 UR - https://doi.org/10.1016/j.tsf.2017.06.058 ER -
APA
Fan, L., Zhou, Y. S., Wang, M. M., Silvain, J., & Lu, Y. F. (2017). Seed-free deposition of large-area adhesive diamond films on copper surfaces processed and patterned by femtosecond lasers. Thin Solid Films. https://doi.org/10.1016/j.tsf.2017.06.058
Source records
- crossref · retrieved 2026-09-25T10:46:20.414Z