The effect of pattern quality on measurements of stress heterogeneity and geometrically necessary dislocation density by high-angular resolution electron backscatter diffraction
- DOI
- 10.1016/j.ultramic.2026.114330
- Published
- 2026-04
- Container
- Ultramicroscopy
- Publisher
- Elsevier BV
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1016/j.ultramic.2026.114330,
title = {The effect of pattern quality on measurements of stress heterogeneity and geometrically necessary dislocation density by high-angular resolution electron backscatter diffraction},
author = {Harison S. Wiesman and David Wallis},
year = {2026},
journal = {Ultramicroscopy},
doi = {10.1016/j.ultramic.2026.114330},
url = {https://doi.org/10.1016/j.ultramic.2026.114330}
}RIS
TY - JOUR TI - The effect of pattern quality on measurements of stress heterogeneity and geometrically necessary dislocation density by high-angular resolution electron backscatter diffraction AU - Harison S. Wiesman AU - David Wallis PY - 2026 JO - Ultramicroscopy DO - 10.1016/j.ultramic.2026.114330 UR - https://doi.org/10.1016/j.ultramic.2026.114330 ER -
APA
Wiesman, H. S., & Wallis, D. (2026). The effect of pattern quality on measurements of stress heterogeneity and geometrically necessary dislocation density by high-angular resolution electron backscatter diffraction. Ultramicroscopy. https://doi.org/10.1016/j.ultramic.2026.114330
Source records
- crossref · retrieved 2026-11-10T13:16:47.481Z