Development of a shear grinding machine for enhanced liberation of copper from waste PCBs

Wonjae Lee, Seungsoo Park

Open source

DOI
10.1016/j.wasman.2025.115080
Published
2025-09
Container
Waste Management
Publisher
Elsevier BV
Open access
unknown

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BibTeX

@article{allodium:10.1016/j.wasman.2025.115080,
  title = {Development of a shear grinding machine for enhanced liberation of copper from waste PCBs},
  author = {Wonjae Lee and Seungsoo Park},
  year = {2025},
  journal = {Waste Management},
  doi = {10.1016/j.wasman.2025.115080},
  url = {https://doi.org/10.1016/j.wasman.2025.115080}
}

RIS

TY  - JOUR
TI  - Development of a shear grinding machine for enhanced liberation of copper from waste PCBs
AU  - Wonjae Lee
AU  - Seungsoo Park
PY  - 2025
JO  - Waste Management
DO  - 10.1016/j.wasman.2025.115080
UR  - https://doi.org/10.1016/j.wasman.2025.115080
ER  - 

APA

Lee, W., & Park, S. (2025). Development of a shear grinding machine for enhanced liberation of copper from waste PCBs. Waste Management. https://doi.org/10.1016/j.wasman.2025.115080

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