Thermo-mechanical coupled separation of high-value BGA components from waste mobile-phone printed circuit boards.
- DOI
- 10.1016/j.wasman.2026.115891
- Published
- 2026 Sep 22
- Container
- Waste management (New York, N.Y.)
- Publisher
- Not recorded
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1016/j.wasman.2026.115891,
title = {Thermo-mechanical coupled separation of high-value BGA components from waste mobile-phone printed circuit boards.},
author = {Xu J and Zhang C and Duan Q and Zhao Z and Wang R and Wang X and Ma E and Guo X},
year = {2026},
journal = {Waste management (New York, N.Y.)},
doi = {10.1016/j.wasman.2026.115891},
url = {https://doi.org/10.1016/j.wasman.2026.115891}
}RIS
TY - JOUR TI - Thermo-mechanical coupled separation of high-value BGA components from waste mobile-phone printed circuit boards. AU - Xu J AU - Zhang C AU - Duan Q AU - Zhao Z AU - Wang R AU - Wang X AU - Ma E AU - Guo X PY - 2026 JO - Waste management (New York, N.Y.) DO - 10.1016/j.wasman.2026.115891 UR - https://doi.org/10.1016/j.wasman.2026.115891 ER -
APA
J, X., C, Z., Q, D., Z, Z., R, W., X, W., E, M., & X, G. (2026). Thermo-mechanical coupled separation of high-value BGA components from waste mobile-phone printed circuit boards.. Waste management (New York, N.Y.). https://doi.org/10.1016/j.wasman.2026.115891
Source records
- pubmed · retrieved 2026-09-26T09:00:59.244Z