Electrochemically-assisted aqueous reduction of gold from printed circuit boards leached with cupric chloride

Reima Herrala, Benjamin P. Wilson, Kirsi Yliniemi, Mari Lundström, Jaana Vapaavuori

Open source

DOI
10.1016/j.wasman.2026.115984
Published
2027-01
Container
Waste Management
Publisher
Elsevier BV
Open access
unknown

Credibility signals

uncertain Score 64/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.

Show all credibility signals

Cite this work

BibTeX

@article{allodium:10.1016/j.wasman.2026.115984,
  title = {Electrochemically-assisted aqueous reduction of gold from printed circuit boards leached with cupric chloride},
  author = {Reima Herrala and Benjamin P. Wilson and Kirsi Yliniemi and Mari Lundström and Jaana Vapaavuori},
  year = {2027},
  journal = {Waste Management},
  doi = {10.1016/j.wasman.2026.115984},
  url = {https://doi.org/10.1016/j.wasman.2026.115984}
}

RIS

TY  - JOUR
TI  - Electrochemically-assisted aqueous reduction of gold from printed circuit boards leached with cupric chloride
AU  - Reima Herrala
AU  - Benjamin P. Wilson
AU  - Kirsi Yliniemi
AU  - Mari Lundström
AU  - Jaana Vapaavuori
PY  - 2027
JO  - Waste Management
DO  - 10.1016/j.wasman.2026.115984
UR  - https://doi.org/10.1016/j.wasman.2026.115984
ER  - 

APA

Herrala, R., Wilson, B. P., Yliniemi, K., Lundström, M., & Vapaavuori, J. (2027). Electrochemically-assisted aqueous reduction of gold from printed circuit boards leached with cupric chloride. Waste Management. https://doi.org/10.1016/j.wasman.2026.115984

Source records