A Compact Mixed Mode (CMM) fracture specimen for adhesive bonded joints

H.L.J. Pang, C.W. Seetoh

Open source

DOI: 10.1016/s0013-7944(97)00014-3
Published: 1997-05
Container: Engineering Fracture Mechanics
Publisher: Elsevier BV
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1016/s0013-7944-97-00014-3,
  title = {A Compact Mixed Mode (CMM) fracture specimen for adhesive bonded joints},
  author = {H.L.J. Pang and C.W. Seetoh},
  year = {1997},
  journal = {Engineering Fracture Mechanics},
  doi = {10.1016/s0013-7944(97)00014-3},
  url = {https://doi.org/10.1016/s0013-7944(97)00014-3}
}

RIS

TY  - JOUR
TI  - A Compact Mixed Mode (CMM) fracture specimen for adhesive bonded joints
AU  - H.L.J. Pang
AU  - C.W. Seetoh
PY  - 1997
JO  - Engineering Fracture Mechanics
DO  - 10.1016/s0013-7944(97)00014-3
UR  - https://doi.org/10.1016/s0013-7944(97)00014-3
ER  -

APA

Pang, H., & Seetoh, C. (1997). A Compact Mixed Mode (CMM) fracture specimen for adhesive bonded joints. Engineering Fracture Mechanics. https://doi.org/10.1016/s0013-7944(97)00014-3

Source records

crossref · retrieved 2026-09-27T16:07:46.488Z