Experimental validation of a thermal modelling method dedicated to multichip power modules in operating conditions

S. Carubelli, Z. Khatir

DOI: 10.1016/s0026-2692(03)00205-2
Published: 2003-12
Container: Microelectronics Journal
Publisher: Not recorded
Open access: no

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Cite this work

BibTeX

@article{allodium:10.1016/s0026-2692-03-00205-2,
  title = {Experimental validation of a thermal modelling method dedicated to multichip power modules in operating conditions},
  author = {S. Carubelli and Z. Khatir},
  year = {2003},
  journal = {Microelectronics Journal},
  doi = {10.1016/s0026-2692(03)00205-2},
  url = {https://doi.org/10.1016/s0026-2692(03)00205-2}
}

RIS

TY  - JOUR
TI  - Experimental validation of a thermal modelling method dedicated to multichip power modules in operating conditions
AU  - S. Carubelli
AU  - Z. Khatir
PY  - 2003
JO  - Microelectronics Journal
DO  - 10.1016/s0026-2692(03)00205-2
UR  - https://doi.org/10.1016/s0026-2692(03)00205-2
ER  -

APA

Carubelli, S., & Khatir, Z. (2003). Experimental validation of a thermal modelling method dedicated to multichip power modules in operating conditions. Microelectronics Journal. https://doi.org/10.1016/s0026-2692(03)00205-2

Source records

hal · retrieved 2026-09-26T00:41:51.457Z