Thermomechanical stress analysis of Cu/low-k dielectric interconnect schemes

Alan Mathewson, Carlos Gonzales Montes De Oca, Sean Foley

Open source

DOI: 10.1016/s0026-2714(01)00160-3
Published: 2001-09
Container: Microelectronics Reliability
Publisher: Elsevier BV
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1016/s0026-2714-01-00160-3,
  title = {Thermomechanical stress analysis of Cu/low-k dielectric interconnect schemes},
  author = {Alan Mathewson and Carlos Gonzales Montes De Oca and Sean Foley},
  year = {2001},
  journal = {Microelectronics Reliability},
  doi = {10.1016/s0026-2714(01)00160-3},
  url = {https://doi.org/10.1016/s0026-2714(01)00160-3}
}

RIS

TY  - JOUR
TI  - Thermomechanical stress analysis of Cu/low-k dielectric interconnect schemes
AU  - Alan Mathewson
AU  - Carlos Gonzales Montes De Oca
AU  - Sean Foley
PY  - 2001
JO  - Microelectronics Reliability
DO  - 10.1016/s0026-2714(01)00160-3
UR  - https://doi.org/10.1016/s0026-2714(01)00160-3
ER  -

APA

Mathewson, A., Oca, C. G. M. D., & Foley, S. (2001). Thermomechanical stress analysis of Cu/low-k dielectric interconnect schemes. Microelectronics Reliability. https://doi.org/10.1016/s0026-2714(01)00160-3

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crossref · retrieved 2026-09-26T09:19:27.891Z