Hot-Carrier Reliability for Si and SiGe HBTs: Aging Procedure, Extrapolation Model Limitations and Applications
- DOI
- 10.1016/s0026-2714(01)00203-7
- Published
- 2001-09
- Container
- Microelectronics Reliability
- Publisher
- Elsevier BV
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1016/s0026-2714-01-00203-7,
title = {Hot-Carrier Reliability for Si and SiGe HBTs: Aging Procedure, Extrapolation Model Limitations and Applications},
author = {N. Revil and X. Garros},
year = {2001},
journal = {Microelectronics Reliability},
doi = {10.1016/s0026-2714(01)00203-7},
url = {https://doi.org/10.1016/s0026-2714(01)00203-7}
}RIS
TY - JOUR TI - Hot-Carrier Reliability for Si and SiGe HBTs: Aging Procedure, Extrapolation Model Limitations and Applications AU - N. Revil AU - X. Garros PY - 2001 JO - Microelectronics Reliability DO - 10.1016/s0026-2714(01)00203-7 UR - https://doi.org/10.1016/s0026-2714(01)00203-7 ER -
APA
Revil, N., & Garros, X. (2001). Hot-Carrier Reliability for Si and SiGe HBTs: Aging Procedure, Extrapolation Model Limitations and Applications. Microelectronics Reliability. https://doi.org/10.1016/s0026-2714(01)00203-7
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- crossref · retrieved 2026-11-10T16:30:02.768Z