Noise in conductive adhesive bonds under mechanical stress as a sensitive and fast diagnostic tool for reliability assessment
- DOI
- 10.1016/s0026-2714(99)00154-7
- Published
- 1999-06
- Container
- Microelectronics Reliability
- Publisher
- Elsevier BV
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1016/s0026-2714-99-00154-7,
title = {Noise in conductive adhesive bonds under mechanical stress as a sensitive and fast diagnostic tool for reliability assessment},
author = {L.K.J. Vandamme and M.G. Perichaud and E. Noguera and Y. Danto and U. Behner},
year = {1999},
journal = {Microelectronics Reliability},
doi = {10.1016/s0026-2714(99)00154-7},
url = {https://doi.org/10.1016/s0026-2714(99)00154-7}
}RIS
TY - JOUR TI - Noise in conductive adhesive bonds under mechanical stress as a sensitive and fast diagnostic tool for reliability assessment AU - L.K.J. Vandamme AU - M.G. Perichaud AU - E. Noguera AU - Y. Danto AU - U. Behner PY - 1999 JO - Microelectronics Reliability DO - 10.1016/s0026-2714(99)00154-7 UR - https://doi.org/10.1016/s0026-2714(99)00154-7 ER -
APA
Vandamme, L., Perichaud, M., Noguera, E., Danto, Y., & Behner, U. (1999). Noise in conductive adhesive bonds under mechanical stress as a sensitive and fast diagnostic tool for reliability assessment. Microelectronics Reliability. https://doi.org/10.1016/s0026-2714(99)00154-7
Source records
- crossref · retrieved 2026-09-26T13:00:29.823Z