The effect of ammonia plasma treatment on low-k methyl-hybrido-silsesquioxane against photoresist stripping damage
- DOI
- 10.1016/s0040-6090(01)01330-x
- Published
- 2001-11
- Container
- Thin Solid Films
- Publisher
- Elsevier BV
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1016/s0040-6090-01-01330-x,
title = {The effect of ammonia plasma treatment on low-k methyl-hybrido-silsesquioxane against photoresist stripping damage},
author = {T.C Chang and Y.S Mor and P.T Liu and T.M Tsai and C.W Chen and Y.J Mei and S.M Sze},
year = {2001},
journal = {Thin Solid Films},
doi = {10.1016/s0040-6090(01)01330-x},
url = {https://doi.org/10.1016/s0040-6090(01)01330-x}
}RIS
TY - JOUR TI - The effect of ammonia plasma treatment on low-k methyl-hybrido-silsesquioxane against photoresist stripping damage AU - T.C Chang AU - Y.S Mor AU - P.T Liu AU - T.M Tsai AU - C.W Chen AU - Y.J Mei AU - S.M Sze PY - 2001 JO - Thin Solid Films DO - 10.1016/s0040-6090(01)01330-x UR - https://doi.org/10.1016/s0040-6090(01)01330-x ER -
APA
Chang, T., Mor, Y., Liu, P., Tsai, T., Chen, C., Mei, Y., & Sze, S. (2001). The effect of ammonia plasma treatment on low-k methyl-hybrido-silsesquioxane against photoresist stripping damage. Thin Solid Films. https://doi.org/10.1016/s0040-6090(01)01330-x
Source records
- crossref · retrieved 2026-09-26T00:57:20.927Z