Water and Hydrogen Bond Donor Effects on Mass Transport and Copper Electrodeposition in Deep Eutectic Solvents
- DOI
- 10.1021/acs.jpcb.6c03669
- Published
- 2026-09-10
- Container
- The Journal of Physical Chemistry B
- Publisher
- American Chemical Society (ACS)
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1021/acs.jpcb.6c03669,
title = {Water and Hydrogen Bond Donor Effects on Mass Transport
and Copper Electrodeposition in Deep Eutectic Solvents},
author = {Vadim L. Filippov and Alexey V. Shapagin and Timofei V. Golubitchenko and Alexander V. Rudnev},
year = {2026},
journal = {The Journal of Physical Chemistry B},
doi = {10.1021/acs.jpcb.6c03669},
url = {https://doi.org/10.1021/acs.jpcb.6c03669}
}RIS
TY - JOUR TI - Water and Hydrogen Bond Donor Effects on Mass Transport and Copper Electrodeposition in Deep Eutectic Solvents AU - Vadim L. Filippov AU - Alexey V. Shapagin AU - Timofei V. Golubitchenko AU - Alexander V. Rudnev PY - 2026 JO - The Journal of Physical Chemistry B DO - 10.1021/acs.jpcb.6c03669 UR - https://doi.org/10.1021/acs.jpcb.6c03669 ER -
APA
Filippov, V. L., Shapagin, A. V., Golubitchenko, T. V., & Rudnev, A. V. (2026). Water and Hydrogen Bond Donor Effects on Mass Transport and Copper Electrodeposition in Deep Eutectic Solvents. The Journal of Physical Chemistry B. https://doi.org/10.1021/acs.jpcb.6c03669
Source records
- crossref · retrieved 2026-11-10T20:39:01.022Z