Dual-Functional Ag-ZnO Nanocomposite Interlayers Enable Robust Copper Metallization on NiFe<sub>2</sub>O<sub>4</sub> Substrates for High-Performance X-Band Ferrite Microstrip Isolators
- DOI
- 10.1021/acs.langmuir.5c03088
- Published
- 2025-08-12
- Container
- Langmuir
- Publisher
- American Chemical Society (ACS)
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1021/acs.langmuir.5c03088,
title = {Dual-Functional Ag-ZnO Nanocomposite Interlayers Enable Robust Copper Metallization on NiFe<sub>2</sub>O<sub>4</sub> Substrates for High-Performance X-Band Ferrite Microstrip Isolators},
author = {Guo-Liang Liu and Diwen Jiang and Li Wang and Le Xu and Hao-Wen Zhang and Kai-Long Li and Zhe-Sheng Feng and Yan Wang},
year = {2025},
journal = {Langmuir},
doi = {10.1021/acs.langmuir.5c03088},
url = {https://doi.org/10.1021/acs.langmuir.5c03088}
}RIS
TY - JOUR TI - Dual-Functional Ag-ZnO Nanocomposite Interlayers Enable Robust Copper Metallization on NiFe<sub>2</sub>O<sub>4</sub> Substrates for High-Performance X-Band Ferrite Microstrip Isolators AU - Guo-Liang Liu AU - Diwen Jiang AU - Li Wang AU - Le Xu AU - Hao-Wen Zhang AU - Kai-Long Li AU - Zhe-Sheng Feng AU - Yan Wang PY - 2025 JO - Langmuir DO - 10.1021/acs.langmuir.5c03088 UR - https://doi.org/10.1021/acs.langmuir.5c03088 ER -
APA
Liu, G., Jiang, D., Wang, L., Xu, L., Zhang, H., Li, K., Feng, Z., & Wang, Y. (2025). Dual-Functional Ag-ZnO Nanocomposite Interlayers Enable Robust Copper Metallization on NiFe<sub>2</sub>O<sub>4</sub> Substrates for High-Performance X-Band Ferrite Microstrip Isolators. Langmuir. https://doi.org/10.1021/acs.langmuir.5c03088
Source records
- crossref · retrieved 2026-11-10T15:11:46.674Z