Hierarchical Crack-Engineered Strain Sensors for Machine-Learning-Enabled Multimodal Recognition and Edge Computing in Ultra-Low-Power Wearables.

Zhu T, Xu Y, Liu S, Xia Y, Dang C, Yang H, Wang Y, Wu K, Xue D, Yang S, Liu G, Sun J, Zhai W

Open source

DOI
10.1021/acs.nanolett.6c00035
Published
2026 Apr 1
Container
Nano letters
Publisher
Not recorded
Open access
unknown

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BibTeX

@article{allodium:10.1021/acs.nanolett.6c00035,
  title = {Hierarchical Crack-Engineered Strain Sensors for Machine-Learning-Enabled Multimodal Recognition and Edge Computing in Ultra-Low-Power Wearables.},
  author = {Zhu T and Xu Y and Liu S and Xia Y and Dang C and Yang H and Wang Y and Wu K and Xue D and Yang S and Liu G and Sun J and Zhai W},
  year = {2026},
  journal = {Nano letters},
  doi = {10.1021/acs.nanolett.6c00035},
  url = {https://doi.org/10.1021/acs.nanolett.6c00035}
}

RIS

TY  - JOUR
TI  - Hierarchical Crack-Engineered Strain Sensors for Machine-Learning-Enabled Multimodal Recognition and Edge Computing in Ultra-Low-Power Wearables.
AU  - Zhu T
AU  - Xu Y
AU  - Liu S
AU  - Xia Y
AU  - Dang C
AU  - Yang H
AU  - Wang Y
AU  - Wu K
AU  - Xue D
AU  - Yang S
AU  - Liu G
AU  - Sun J
AU  - Zhai W
PY  - 2026
JO  - Nano letters
DO  - 10.1021/acs.nanolett.6c00035
UR  - https://doi.org/10.1021/acs.nanolett.6c00035
ER  - 

APA

T, Z., Y, X., S, L., Y, X., C, D., H, Y., Y, W., K, W., D, X., S, Y., G, L., J, S., & W, Z. (2026). Hierarchical Crack-Engineered Strain Sensors for Machine-Learning-Enabled Multimodal Recognition and Edge Computing in Ultra-Low-Power Wearables.. Nano letters. https://doi.org/10.1021/acs.nanolett.6c00035

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