Crack-Free Precision during Desiccation: Optimizing Aerosol Jet Printing for High-Performance Conductive Microstructure Manufacturing
- DOI
- 10.1021/acs.nanolett.6c01881
- Published
- 2026-06-08
- Container
- Nano Letters
- Publisher
- American Chemical Society (ACS)
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1021/acs.nanolett.6c01881,
title = {Crack-Free
Precision during Desiccation: Optimizing
Aerosol Jet Printing for High-Performance Conductive Microstructure
Manufacturing},
author = {Geng Li and Yuxin Sun and Yanhong Tian and Jing Yu and Karol Viviana Mejia-Centeno and Malik Dilshad Khan and Shang Wang and Jordi Arbiol and Andreu Cabot and Qing Sun},
year = {2026},
journal = {Nano Letters},
doi = {10.1021/acs.nanolett.6c01881},
url = {https://doi.org/10.1021/acs.nanolett.6c01881}
}RIS
TY - JOUR TI - Crack-Free Precision during Desiccation: Optimizing Aerosol Jet Printing for High-Performance Conductive Microstructure Manufacturing AU - Geng Li AU - Yuxin Sun AU - Yanhong Tian AU - Jing Yu AU - Karol Viviana Mejia-Centeno AU - Malik Dilshad Khan AU - Shang Wang AU - Jordi Arbiol AU - Andreu Cabot AU - Qing Sun PY - 2026 JO - Nano Letters DO - 10.1021/acs.nanolett.6c01881 UR - https://doi.org/10.1021/acs.nanolett.6c01881 ER -
APA
Li, G., Sun, Y., Tian, Y., Yu, J., Mejia-Centeno, K. V., Khan, M. D., Wang, S., Arbiol, J., Cabot, A., & Sun, Q. (2026). Crack-Free Precision during Desiccation: Optimizing Aerosol Jet Printing for High-Performance Conductive Microstructure Manufacturing. Nano Letters. https://doi.org/10.1021/acs.nanolett.6c01881
Source records
- crossref · retrieved 2026-11-10T14:35:03.616Z