In situ Thermoreflectance Characterization of Thermal Resistance in Multilayer Electronics Packaging.

Poopakdee N, Abdallah Z, Pomeroy JW, Kuball M

DOI: 10.1021/acsaelm.1c01239
Published: 2022 Apr 26
Container: ACS applied electronic materials
Publisher: Not recorded
Open access: yes

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Cite this work

BibTeX

@article{allodium:10.1021/acsaelm.1c01239,
  title = {In situ Thermoreflectance Characterization of Thermal Resistance in Multilayer Electronics Packaging.},
  author = {Poopakdee N and Abdallah Z and Pomeroy JW and Kuball M},
  year = {2022},
  journal = {ACS applied electronic materials},
  doi = {10.1021/acsaelm.1c01239},
  url = {https://doi.org/10.1021/acsaelm.1c01239}
}

RIS

TY  - JOUR
TI  - In situ Thermoreflectance Characterization of Thermal Resistance in Multilayer Electronics Packaging.
AU  - Poopakdee N
AU  - Abdallah Z
AU  - Pomeroy JW
AU  - Kuball M
PY  - 2022
JO  - ACS applied electronic materials
DO  - 10.1021/acsaelm.1c01239
UR  - https://doi.org/10.1021/acsaelm.1c01239
ER  -

APA

N, P., Z, A., JW, P., & M, K. (2022). In situ Thermoreflectance Characterization of Thermal Resistance in Multilayer Electronics Packaging.. ACS applied electronic materials. https://doi.org/10.1021/acsaelm.1c01239

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pubmed · retrieved 2026-09-25T18:47:13.285Z