Enhancement of NH<sub>3</sub> Production in Electrochemical N<sub>2</sub> Reduction by the Cu-Rich Inner Surfaces of Beveled CuAu Nanoboxes

Biva Talukdar, Tung-Chun Kuo, Brian T. Sneed, Lian-Ming Lyu, Hung-Min Lin, Yu-Chun Chuang, Mu-Jeng Cheng, Chun-Hong Kuo

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DOI
10.1021/acsami.1c03454
Published
2021-04-12
Container
ACS Applied Materials &amp; Interfaces
Publisher
American Chemical Society (ACS)
Open access
unknown

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BibTeX

@article{allodium:10.1021/acsami.1c03454,
  title = {Enhancement of NH<sub>3</sub> Production in Electrochemical N<sub>2</sub> Reduction by the Cu-Rich Inner Surfaces of Beveled CuAu Nanoboxes},
  author = {Biva Talukdar and Tung-Chun Kuo and Brian T. Sneed and Lian-Ming Lyu and Hung-Min Lin and Yu-Chun Chuang and Mu-Jeng Cheng and Chun-Hong Kuo},
  year = {2021},
  journal = {ACS Applied Materials \&amp; Interfaces},
  doi = {10.1021/acsami.1c03454},
  url = {https://doi.org/10.1021/acsami.1c03454}
}

RIS

TY  - JOUR
TI  - Enhancement of NH<sub>3</sub> Production in Electrochemical N<sub>2</sub> Reduction by the Cu-Rich Inner Surfaces of Beveled CuAu Nanoboxes
AU  - Biva Talukdar
AU  - Tung-Chun Kuo
AU  - Brian T. Sneed
AU  - Lian-Ming Lyu
AU  - Hung-Min Lin
AU  - Yu-Chun Chuang
AU  - Mu-Jeng Cheng
AU  - Chun-Hong Kuo
PY  - 2021
JO  - ACS Applied Materials &amp; Interfaces
DO  - 10.1021/acsami.1c03454
UR  - https://doi.org/10.1021/acsami.1c03454
ER  - 

APA

Talukdar, B., Kuo, T., Sneed, B. T., Lyu, L., Lin, H., Chuang, Y., Cheng, M., & Kuo, C. (2021). Enhancement of NH<sub>3</sub> Production in Electrochemical N<sub>2</sub> Reduction by the Cu-Rich Inner Surfaces of Beveled CuAu Nanoboxes. ACS Applied Materials &amp; Interfaces. https://doi.org/10.1021/acsami.1c03454

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