Electrocaloric Performance of Multilayer Ceramic Chips: Effect of Geometric Structure Induced Internal Stress.

Cheng LQ, Yan Y, Li X, Xiong X, Chen X, Zhu LF, Li W, Chen K, Sanghadasa M, Priya S

Open source

DOI
10.1021/acsami.1c09911
Published
2021 Aug 18
Container
ACS applied materials & interfaces
Publisher
Not recorded
Open access
unknown

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BibTeX

@article{allodium:10.1021/acsami.1c09911,
  title = {Electrocaloric Performance of Multilayer Ceramic Chips: Effect of Geometric Structure Induced Internal Stress.},
  author = {Cheng LQ and Yan Y and Li X and Xiong X and Chen X and Zhu LF and Li W and Chen K and Sanghadasa M and Priya S},
  year = {2021},
  journal = {ACS applied materials \& interfaces},
  doi = {10.1021/acsami.1c09911},
  url = {https://doi.org/10.1021/acsami.1c09911}
}

RIS

TY  - JOUR
TI  - Electrocaloric Performance of Multilayer Ceramic Chips: Effect of Geometric Structure Induced Internal Stress.
AU  - Cheng LQ
AU  - Yan Y
AU  - Li X
AU  - Xiong X
AU  - Chen X
AU  - Zhu LF
AU  - Li W
AU  - Chen K
AU  - Sanghadasa M
AU  - Priya S
PY  - 2021
JO  - ACS applied materials & interfaces
DO  - 10.1021/acsami.1c09911
UR  - https://doi.org/10.1021/acsami.1c09911
ER  - 

APA

LQ, C., Y, Y., X, L., X, X., X, C., LF, Z., W, L., K, C., M, S., & S, P. (2021). Electrocaloric Performance of Multilayer Ceramic Chips: Effect of Geometric Structure Induced Internal Stress.. ACS applied materials & interfaces. https://doi.org/10.1021/acsami.1c09911

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