Electrocaloric Performance of Multilayer Ceramic Chips: Effect of Geometric Structure Induced Internal Stress.
- DOI
- 10.1021/acsami.1c09911
- Published
- 2021 Aug 18
- Container
- ACS applied materials & interfaces
- Publisher
- Not recorded
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1021/acsami.1c09911,
title = {Electrocaloric Performance of Multilayer Ceramic Chips: Effect of Geometric Structure Induced Internal Stress.},
author = {Cheng LQ and Yan Y and Li X and Xiong X and Chen X and Zhu LF and Li W and Chen K and Sanghadasa M and Priya S},
year = {2021},
journal = {ACS applied materials \& interfaces},
doi = {10.1021/acsami.1c09911},
url = {https://doi.org/10.1021/acsami.1c09911}
}RIS
TY - JOUR TI - Electrocaloric Performance of Multilayer Ceramic Chips: Effect of Geometric Structure Induced Internal Stress. AU - Cheng LQ AU - Yan Y AU - Li X AU - Xiong X AU - Chen X AU - Zhu LF AU - Li W AU - Chen K AU - Sanghadasa M AU - Priya S PY - 2021 JO - ACS applied materials & interfaces DO - 10.1021/acsami.1c09911 UR - https://doi.org/10.1021/acsami.1c09911 ER -
APA
LQ, C., Y, Y., X, L., X, X., X, C., LF, Z., W, L., K, C., M, S., & S, P. (2021). Electrocaloric Performance of Multilayer Ceramic Chips: Effect of Geometric Structure Induced Internal Stress.. ACS applied materials & interfaces. https://doi.org/10.1021/acsami.1c09911
Source records
- pubmed · retrieved 2026-09-26T13:10:54.801Z