Achieving a High Thermally Conductive One Micron AlN Deposition by High Power Impulse Magnetron Sputtering plus Kick.

Lee PC, McLeod AJ, Choi M, Vaca D, Mora DC, Wang K, Yun S, Dutta J, Pal D, Kumar S, Kummel AC

Open source

DOI
10.1021/acsami.4c00993
Published
2024 May 22
Container
ACS applied materials & interfaces
Publisher
Not recorded
Open access
no

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BibTeX

@article{allodium:10.1021/acsami.4c00993,
  title = {Achieving a High Thermally Conductive One Micron AlN Deposition by High Power Impulse Magnetron Sputtering plus Kick.},
  author = {Lee PC and McLeod AJ and Choi M and Vaca D and Mora DC and Wang K and Yun S and Dutta J and Pal D and Kumar S and Kummel AC},
  year = {2024},
  journal = {ACS applied materials \& interfaces},
  doi = {10.1021/acsami.4c00993},
  url = {https://doi.org/10.1021/acsami.4c00993}
}

RIS

TY  - JOUR
TI  - Achieving a High Thermally Conductive One Micron AlN Deposition by High Power Impulse Magnetron Sputtering plus Kick.
AU  - Lee PC
AU  - McLeod AJ
AU  - Choi M
AU  - Vaca D
AU  - Mora DC
AU  - Wang K
AU  - Yun S
AU  - Dutta J
AU  - Pal D
AU  - Kumar S
AU  - Kummel AC
PY  - 2024
JO  - ACS applied materials & interfaces
DO  - 10.1021/acsami.4c00993
UR  - https://doi.org/10.1021/acsami.4c00993
ER  - 

APA

PC, L., AJ, M., M, C., D, V., DC, M., K, W., S, Y., J, D., D, P., S, K., & AC, K. (2024). Achieving a High Thermally Conductive One Micron AlN Deposition by High Power Impulse Magnetron Sputtering plus Kick.. ACS applied materials & interfaces. https://doi.org/10.1021/acsami.4c00993

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