Fundamental Insights into Copper-Epoxy Interfaces for High-Frequency Chip-to-Chip Interconnects.
- DOI
- 10.1021/acsami.4c16414
- Published
- 2024-12-18
- Container
- ACS Appl Mater Interfaces
- Publisher
- Not recorded
- Open access
- yes
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Cite this work
BibTeX
@article{allodium:10.1021/acsami.4c16414,
title = {Fundamental Insights into Copper-Epoxy Interfaces for High-Frequency Chip-to-Chip Interconnects.},
author = {Park J and Dauda M and Bello M and Agbadan I and Engler AC and Williamson JM and Mathew V and Park S and Flake JC.},
year = {2025},
journal = {ACS Appl Mater Interfaces},
doi = {10.1021/acsami.4c16414},
url = {https://doi.org/10.1021/acsami.4c16414}
}RIS
TY - JOUR TI - Fundamental Insights into Copper-Epoxy Interfaces for High-Frequency Chip-to-Chip Interconnects. AU - Park J AU - Dauda M AU - Bello M AU - Agbadan I AU - Engler AC AU - Williamson JM AU - Mathew V AU - Park S AU - Flake JC. PY - 2025 JO - ACS Appl Mater Interfaces DO - 10.1021/acsami.4c16414 UR - https://doi.org/10.1021/acsami.4c16414 ER -
APA
J, P., M, D., M, B., I, A., AC, E., JM, W., V, M., S, P., & JC., F. (2025). Fundamental Insights into Copper-Epoxy Interfaces for High-Frequency Chip-to-Chip Interconnects.. ACS Appl Mater Interfaces. https://doi.org/10.1021/acsami.4c16414
Source records
- europe-pmc · retrieved 2026-09-26T13:28:44.679Z