Low-Temperature In Situ Bonding with Ion-Free Neutral Species and Ammonia-Enhanced Activation for Microfluidic Chip Architecture.

Yuan X, Liu L, Niu F, Qi X, Zhou X, Yu G, Suga T, Wang C

DOI: 10.1021/acsami.5c05628
Published: 2025 Aug 13
Container: ACS applied materials & interfaces
Publisher: Not recorded
Open access: unknown

Credibility signals

limited evidence Score 43/100 under policy 1.0.0. This is a metadata assessment, not a judgment of the paper's conclusions.

Show all credibility signals

cautionDOI registered: No matching Crossref record was present in this response. Source: Crossref; license: CC0 metadata
cautionDOI resolves: No matching Crossref record was present in this response. Source: Crossref; license: CC0 metadata
not scoredDirectory of Open Access Journals: No matching DOAJ record was present in this response. No allow-list match; this is not evidence of low credibility. Source: DOAJ; license: CC0
not scoredMEDLINE indexed: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredOpenAlex core source: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredKnown publisher allow-list: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredROR affiliation: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredRetraction Watch retraction: No retraction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
not scoredRetraction Watch expression of concern: No expression of concern notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
not scoredRetraction Watch correction: No correction notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
not scoredRetraction Watch reinstatement: No reinstatement notice matched this DOI in the deployed snapshot. No matching event found; coverage may be incomplete. Source: Retraction Watch; license: CC BY 4.0
not scoredOpen access status: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredPublication license: Not checked or no result supplied; no credibility inference made. Source: No authority result supplied; license: Unknown
not scoredPublication version: A publication version was supplied but is not scored. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer
cautionMetadata completeness: 5 of 6 scored descriptive metadata groups are present; missing fields increase uncertainty. Source: Normalized work metadata; license: Caller-provided; provenance license not supplied to scorer

Cite this work

BibTeX

@article{allodium:10.1021/acsami.5c05628,
  title = {Low-Temperature In Situ Bonding with Ion-Free Neutral Species and Ammonia-Enhanced Activation for Microfluidic Chip Architecture.},
  author = {Yuan X and Liu L and Niu F and Qi X and Zhou X and Yu G and Suga T and Wang C},
  year = {2025},
  journal = {ACS applied materials \& interfaces},
  doi = {10.1021/acsami.5c05628},
  url = {https://doi.org/10.1021/acsami.5c05628}
}

RIS

TY  - JOUR
TI  - Low-Temperature In Situ Bonding with Ion-Free Neutral Species and Ammonia-Enhanced Activation for Microfluidic Chip Architecture.
AU  - Yuan X
AU  - Liu L
AU  - Niu F
AU  - Qi X
AU  - Zhou X
AU  - Yu G
AU  - Suga T
AU  - Wang C
PY  - 2025
JO  - ACS applied materials & interfaces
DO  - 10.1021/acsami.5c05628
UR  - https://doi.org/10.1021/acsami.5c05628
ER  -

APA

X, Y., L, L., F, N., X, Q., X, Z., G, Y., T, S., & C, W. (2025). Low-Temperature In Situ Bonding with Ion-Free Neutral Species and Ammonia-Enhanced Activation for Microfluidic Chip Architecture.. ACS applied materials & interfaces. https://doi.org/10.1021/acsami.5c05628

Source records

pubmed · retrieved 2026-09-26T02:03:04.819Z