Low-Temperature Ru-Ru Hybrid Bonding: Ar/H(2) Plasma and NH(4)OH Synergistic Activation for Ultrahigh Density Interconnection.

Bai Y, Yang J, Li X, Kang Q, Xiu Z, Suga T, Wang C

DOI: 10.1021/acsami.5c23710
Published: 2026 Mar 4
Container: ACS applied materials & interfaces
Publisher: Not recorded
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1021/acsami.5c23710,
  title = {Low-Temperature Ru-Ru Hybrid Bonding: Ar/H(2) Plasma and NH(4)OH Synergistic Activation for Ultrahigh Density Interconnection.},
  author = {Bai Y and Yang J and Li X and Kang Q and Xiu Z and Suga T and Wang C},
  year = {2026},
  journal = {ACS applied materials \& interfaces},
  doi = {10.1021/acsami.5c23710},
  url = {https://doi.org/10.1021/acsami.5c23710}
}

RIS

TY  - JOUR
TI  - Low-Temperature Ru-Ru Hybrid Bonding: Ar/H(2) Plasma and NH(4)OH Synergistic Activation for Ultrahigh Density Interconnection.
AU  - Bai Y
AU  - Yang J
AU  - Li X
AU  - Kang Q
AU  - Xiu Z
AU  - Suga T
AU  - Wang C
PY  - 2026
JO  - ACS applied materials & interfaces
DO  - 10.1021/acsami.5c23710
UR  - https://doi.org/10.1021/acsami.5c23710
ER  -

APA

Y, B., J, Y., X, L., Q, K., Z, X., T, S., & C, W. (2026). Low-Temperature Ru-Ru Hybrid Bonding: Ar/H(2) Plasma and NH(4)OH Synergistic Activation for Ultrahigh Density Interconnection.. ACS applied materials & interfaces. https://doi.org/10.1021/acsami.5c23710

Source records

pubmed · retrieved 2026-09-26T15:49:53.853Z