Heterogeneous 3D Integration Based on Atomic-Level Electronics
- DOI
- 10.1021/acsami.6c00756
- Published
- 2026-04-07
- Container
- ACS Applied Materials & Interfaces
- Publisher
- American Chemical Society (ACS)
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1021/acsami.6c00756,
title = {Heterogeneous 3D Integration Based on Atomic-Level Electronics},
author = {Hyunho Seok and Sihoon Son and Hyunbin Choi and Jinhyoung Lee and Geonwook Kim and Gunhyoung Kim and Dongho Lee and Seowoo Son and Taesung Kim},
year = {2026},
journal = {ACS Applied Materials \& Interfaces},
doi = {10.1021/acsami.6c00756},
url = {https://doi.org/10.1021/acsami.6c00756}
}RIS
TY - JOUR TI - Heterogeneous 3D Integration Based on Atomic-Level Electronics AU - Hyunho Seok AU - Sihoon Son AU - Hyunbin Choi AU - Jinhyoung Lee AU - Geonwook Kim AU - Gunhyoung Kim AU - Dongho Lee AU - Seowoo Son AU - Taesung Kim PY - 2026 JO - ACS Applied Materials & Interfaces DO - 10.1021/acsami.6c00756 UR - https://doi.org/10.1021/acsami.6c00756 ER -
APA
Seok, H., Son, S., Choi, H., Lee, J., Kim, G., Kim, G., Lee, D., Son, S., & Kim, T. (2026). Heterogeneous 3D Integration Based on Atomic-Level Electronics. ACS Applied Materials & Interfaces. https://doi.org/10.1021/acsami.6c00756
Source records
- crossref · retrieved 2026-09-26T13:09:09.052Z