Abrasive Materials for Semiconductor Chemical Mechanical Polishing: Composition, Performance, and Emerging Trends.

Lin X, Wang J, Cai S, Wang Y, Liu Z

DOI: 10.1021/acsami.6c04556
Published: 2026 Jun 3
Container: ACS applied materials & interfaces
Publisher: Not recorded
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1021/acsami.6c04556,
  title = {Abrasive Materials for Semiconductor Chemical Mechanical Polishing: Composition, Performance, and Emerging Trends.},
  author = {Lin X and Wang J and Cai S and Wang Y and Liu Z},
  year = {2026},
  journal = {ACS applied materials \& interfaces},
  doi = {10.1021/acsami.6c04556},
  url = {https://doi.org/10.1021/acsami.6c04556}
}

RIS

TY  - JOUR
TI  - Abrasive Materials for Semiconductor Chemical Mechanical Polishing: Composition, Performance, and Emerging Trends.
AU  - Lin X
AU  - Wang J
AU  - Cai S
AU  - Wang Y
AU  - Liu Z
PY  - 2026
JO  - ACS applied materials & interfaces
DO  - 10.1021/acsami.6c04556
UR  - https://doi.org/10.1021/acsami.6c04556
ER  -

APA

X, L., J, W., S, C., Y, W., & Z, L. (2026). Abrasive Materials for Semiconductor Chemical Mechanical Polishing: Composition, Performance, and Emerging Trends.. ACS applied materials & interfaces. https://doi.org/10.1021/acsami.6c04556

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pubmed · retrieved 2026-09-27T14:32:27.801Z