Decoupling Moisture and Hydrogen Barrier Properties in Silicon Nitride Films Deposited by Plasma-Enhanced Atomic Layer Deposition at 100 °C via Precursor-Defined Bonding Networks.

Kim JM, Kim TK, Oh HJ, Oh MH, Baek JH, Yang TR, Gwoen JH, Song KC, Lee YH, Park JS

Open source

DOI
10.1021/acsami.6c04884
Published
2026 Jul 1
Container
ACS applied materials & interfaces
Publisher
Not recorded
Open access
no

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BibTeX

@article{allodium:10.1021/acsami.6c04884,
  title = {Decoupling Moisture and Hydrogen Barrier Properties in Silicon Nitride Films Deposited by Plasma-Enhanced Atomic Layer Deposition at 100 °C via Precursor-Defined Bonding Networks.},
  author = {Kim JM and Kim TK and Oh HJ and Oh MH and Baek JH and Yang TR and Gwoen JH and Song KC and Lee YH and Park JS},
  year = {2026},
  journal = {ACS applied materials \& interfaces},
  doi = {10.1021/acsami.6c04884},
  url = {https://doi.org/10.1021/acsami.6c04884}
}

RIS

TY  - JOUR
TI  - Decoupling Moisture and Hydrogen Barrier Properties in Silicon Nitride Films Deposited by Plasma-Enhanced Atomic Layer Deposition at 100 °C via Precursor-Defined Bonding Networks.
AU  - Kim JM
AU  - Kim TK
AU  - Oh HJ
AU  - Oh MH
AU  - Baek JH
AU  - Yang TR
AU  - Gwoen JH
AU  - Song KC
AU  - Lee YH
AU  - Park JS
PY  - 2026
JO  - ACS applied materials & interfaces
DO  - 10.1021/acsami.6c04884
UR  - https://doi.org/10.1021/acsami.6c04884
ER  - 

APA

JM, K., TK, K., HJ, O., MH, O., JH, B., TR, Y., JH, G., KC, S., YH, L., & JS, P. (2026). Decoupling Moisture and Hydrogen Barrier Properties in Silicon Nitride Films Deposited by Plasma-Enhanced Atomic Layer Deposition at 100 °C via Precursor-Defined Bonding Networks.. ACS applied materials & interfaces. https://doi.org/10.1021/acsami.6c04884

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