Torque-Driven Grain Rotation in Solder Interconnects under Electromigration for Advanced Packaging: Insights from Phase-Field Simulations.

Jiang H, Xu Y, Ramachandran S, Liang S

DOI: 10.1021/acsami.6c05588
Published: 2026 Jul 1
Container: ACS applied materials & interfaces
Publisher: Not recorded
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1021/acsami.6c05588,
  title = {Torque-Driven Grain Rotation in Solder Interconnects under Electromigration for Advanced Packaging: Insights from Phase-Field Simulations.},
  author = {Jiang H and Xu Y and Ramachandran S and Liang S},
  year = {2026},
  journal = {ACS applied materials \& interfaces},
  doi = {10.1021/acsami.6c05588},
  url = {https://doi.org/10.1021/acsami.6c05588}
}

RIS

TY  - JOUR
TI  - Torque-Driven Grain Rotation in Solder Interconnects under Electromigration for Advanced Packaging: Insights from Phase-Field Simulations.
AU  - Jiang H
AU  - Xu Y
AU  - Ramachandran S
AU  - Liang S
PY  - 2026
JO  - ACS applied materials & interfaces
DO  - 10.1021/acsami.6c05588
UR  - https://doi.org/10.1021/acsami.6c05588
ER  -

APA

H, J., Y, X., S, R., & S, L. (2026). Torque-Driven Grain Rotation in Solder Interconnects under Electromigration for Advanced Packaging: Insights from Phase-Field Simulations.. ACS applied materials & interfaces. https://doi.org/10.1021/acsami.6c05588

Source records

pubmed · retrieved 2026-11-10T09:58:59.038Z