Amorphous Nanodomains Enable High Device-Level Cooling Performance in Crack-Free Hot-Extruded n-Type Bi2Te3 Thermoelectrics

Xiaoming Hu, Veera Prabu Kannan, Xin Chen, Jiachang Shui, Yawei Li, Guangqiang Li, Xi’an Fan, Bhuvanesh Srinivasan, Matthew Barnett

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DOI: 10.1021/acsami.6c08009
Published: 2026-09-04
Container: ACS Applied Materials & Interfaces
Publisher: American Chemical Society (ACS)
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1021/acsami.6c08009,
  title = {Amorphous Nanodomains Enable High Device-Level Cooling Performance in Crack-Free Hot-Extruded n-Type Bi2Te3 Thermoelectrics},
  author = {Xiaoming Hu and Veera Prabu Kannan and Xin Chen and Jiachang Shui and Yawei Li and Guangqiang Li and Xi’an Fan and Bhuvanesh Srinivasan and Matthew Barnett},
  year = {2026},
  journal = {ACS Applied Materials \&amp; Interfaces},
  doi = {10.1021/acsami.6c08009},
  url = {https://doi.org/10.1021/acsami.6c08009}
}

RIS

TY  - JOUR
TI  - Amorphous Nanodomains Enable High Device-Level Cooling Performance in Crack-Free Hot-Extruded n-Type Bi2Te3 Thermoelectrics
AU  - Xiaoming Hu
AU  - Veera Prabu Kannan
AU  - Xin Chen
AU  - Jiachang Shui
AU  - Yawei Li
AU  - Guangqiang Li
AU  - Xi’an Fan
AU  - Bhuvanesh Srinivasan
AU  - Matthew Barnett
PY  - 2026
JO  - ACS Applied Materials &amp; Interfaces
DO  - 10.1021/acsami.6c08009
UR  - https://doi.org/10.1021/acsami.6c08009
ER  -

APA

Hu, X., Kannan, V. P., Chen, X., Shui, J., Li, Y., Li, G., Fan, X., Srinivasan, B., & Barnett, M. (2026). Amorphous Nanodomains Enable High Device-Level Cooling Performance in Crack-Free Hot-Extruded n-Type Bi2Te3 Thermoelectrics. ACS Applied Materials & Interfaces. https://doi.org/10.1021/acsami.6c08009

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crossref · retrieved 2026-09-24T23:49:07.033Z