Coercive Field Reduction in Ultra-Thin Al1-xScxN via Interfacial Engineering with a Scandium Bottom Electrode.

Zhang Y, Rai RK, Esteves G, Wang Y, Jariwala DM, Stach EA, Olsson RH 3rd

Open source

DOI
10.1021/acsami.6c08411
Published
2026 Sep 16
Container
ACS applied materials & interfaces
Publisher
Not recorded
Open access
unknown

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BibTeX

@article{allodium:10.1021/acsami.6c08411,
  title = {Coercive Field Reduction in Ultra-Thin Al1-xScxN via Interfacial Engineering with a Scandium Bottom Electrode.},
  author = {Zhang Y and Rai RK and Esteves G and Wang Y and Jariwala DM and Stach EA and Olsson RH 3rd},
  year = {2026},
  journal = {ACS applied materials \& interfaces},
  doi = {10.1021/acsami.6c08411},
  url = {https://doi.org/10.1021/acsami.6c08411}
}

RIS

TY  - JOUR
TI  - Coercive Field Reduction in Ultra-Thin Al1-xScxN via Interfacial Engineering with a Scandium Bottom Electrode.
AU  - Zhang Y
AU  - Rai RK
AU  - Esteves G
AU  - Wang Y
AU  - Jariwala DM
AU  - Stach EA
AU  - Olsson RH 3rd
PY  - 2026
JO  - ACS applied materials & interfaces
DO  - 10.1021/acsami.6c08411
UR  - https://doi.org/10.1021/acsami.6c08411
ER  - 

APA

Y, Z., RK, R., G, E., Y, W., DM, J., EA, S., & 3rd, O. R. (2026). Coercive Field Reduction in Ultra-Thin Al1-xScxN via Interfacial Engineering with a Scandium Bottom Electrode.. ACS applied materials & interfaces. https://doi.org/10.1021/acsami.6c08411

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