Photosensitive Polyimides as Enabling Materials for Advanced Semiconductor Packaging

Chungen Hsu, Chenlei Pang, Qinghua Lu, Seongku Kim

Open source

DOI: 10.1021/acsami.6c09651
Published: 2026-08-07
Container: ACS Applied Materials & Interfaces
Publisher: American Chemical Society (ACS)
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1021/acsami.6c09651,
  title = {Photosensitive Polyimides as Enabling Materials for Advanced Semiconductor Packaging},
  author = {Chungen Hsu and Chenlei Pang and Qinghua Lu and Seongku Kim},
  year = {2026},
  journal = {ACS Applied Materials \&amp; Interfaces},
  doi = {10.1021/acsami.6c09651},
  url = {https://doi.org/10.1021/acsami.6c09651}
}

RIS

TY  - JOUR
TI  - Photosensitive Polyimides as Enabling Materials for Advanced Semiconductor Packaging
AU  - Chungen Hsu
AU  - Chenlei Pang
AU  - Qinghua Lu
AU  - Seongku Kim
PY  - 2026
JO  - ACS Applied Materials &amp; Interfaces
DO  - 10.1021/acsami.6c09651
UR  - https://doi.org/10.1021/acsami.6c09651
ER  -

APA

Hsu, C., Pang, C., Lu, Q., & Kim, S. (2026). Photosensitive Polyimides as Enabling Materials for Advanced Semiconductor Packaging. ACS Applied Materials & Interfaces. https://doi.org/10.1021/acsami.6c09651

Source records

crossref · retrieved 2026-09-26T01:01:09.259Z