Dynamic-Bonded Conductive Pressure-Sensitive Adhesive Elastomer for Antibacterial Wound Repair and Real-Time Strain Monitoring.

Huang Z, Zhang J, Ma Y, Peng R, Liu X, Song Y, Pu F, Gao Y

DOI: 10.1021/acsami.6c11443
Published: 2026 Sep 9
Container: ACS applied materials & interfaces
Publisher: Not recorded
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1021/acsami.6c11443,
  title = {Dynamic-Bonded Conductive Pressure-Sensitive Adhesive Elastomer for Antibacterial Wound Repair and Real-Time Strain Monitoring.},
  author = {Huang Z and Zhang J and Ma Y and Peng R and Liu X and Song Y and Pu F and Gao Y},
  year = {2026},
  journal = {ACS applied materials \& interfaces},
  doi = {10.1021/acsami.6c11443},
  url = {https://doi.org/10.1021/acsami.6c11443}
}

RIS

TY  - JOUR
TI  - Dynamic-Bonded Conductive Pressure-Sensitive Adhesive Elastomer for Antibacterial Wound Repair and Real-Time Strain Monitoring.
AU  - Huang Z
AU  - Zhang J
AU  - Ma Y
AU  - Peng R
AU  - Liu X
AU  - Song Y
AU  - Pu F
AU  - Gao Y
PY  - 2026
JO  - ACS applied materials & interfaces
DO  - 10.1021/acsami.6c11443
UR  - https://doi.org/10.1021/acsami.6c11443
ER  -

APA

Z, H., J, Z., Y, M., R, P., X, L., Y, S., F, P., & Y, G. (2026). Dynamic-Bonded Conductive Pressure-Sensitive Adhesive Elastomer for Antibacterial Wound Repair and Real-Time Strain Monitoring.. ACS applied materials & interfaces. https://doi.org/10.1021/acsami.6c11443

Source records

pubmed · retrieved 2026-09-25T18:10:34.693Z