Low Resistivity Scaling of RuAl-Based Medium-to-High-Entropy Intermetallic Compounds as Potential Interconnect Metallization.
- DOI
- 10.1021/acsami.6c12263
- Published
- 2026 Aug 19
- Container
- ACS applied materials & interfaces
- Publisher
- Not recorded
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1021/acsami.6c12263,
title = {Low Resistivity Scaling of RuAl-Based Medium-to-High-Entropy Intermetallic Compounds as Potential Interconnect Metallization.},
author = {Fang YY and Tsai CY and Chien WZ and Jhan DJ and Lu MY and Tsou NT and Chang SY},
year = {2026},
journal = {ACS applied materials \& interfaces},
doi = {10.1021/acsami.6c12263},
url = {https://doi.org/10.1021/acsami.6c12263}
}RIS
TY - JOUR TI - Low Resistivity Scaling of RuAl-Based Medium-to-High-Entropy Intermetallic Compounds as Potential Interconnect Metallization. AU - Fang YY AU - Tsai CY AU - Chien WZ AU - Jhan DJ AU - Lu MY AU - Tsou NT AU - Chang SY PY - 2026 JO - ACS applied materials & interfaces DO - 10.1021/acsami.6c12263 UR - https://doi.org/10.1021/acsami.6c12263 ER -
APA
YY, F., CY, T., WZ, C., DJ, J., MY, L., NT, T., & SY, C. (2026). Low Resistivity Scaling of RuAl-Based Medium-to-High-Entropy Intermetallic Compounds as Potential Interconnect Metallization.. ACS applied materials & interfaces. https://doi.org/10.1021/acsami.6c12263
Source records
- pubmed · retrieved 2026-09-25T21:38:05.326Z