Constructing Microstructured Starch Films via Hydrogen Bonding Manipulation for Transient Flexible Electronics
- DOI
- 10.1021/acsami.6c13390
- Published
- 2026-09-12
- Container
- ACS Applied Materials & Interfaces
- Publisher
- American Chemical Society (ACS)
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1021/acsami.6c13390,
title = {Constructing Microstructured Starch Films via Hydrogen Bonding Manipulation for Transient Flexible Electronics},
author = {Huacui Xiang and Lulu Ning and Zhou Bai and Zhijian Li and Haiwei Wu and Guodong Liu and Hongwei Zhou and Chaoji Chen and Peng Peng and Hanbin Liu},
year = {2026},
journal = {ACS Applied Materials \& Interfaces},
doi = {10.1021/acsami.6c13390},
url = {https://doi.org/10.1021/acsami.6c13390}
}RIS
TY - JOUR TI - Constructing Microstructured Starch Films via Hydrogen Bonding Manipulation for Transient Flexible Electronics AU - Huacui Xiang AU - Lulu Ning AU - Zhou Bai AU - Zhijian Li AU - Haiwei Wu AU - Guodong Liu AU - Hongwei Zhou AU - Chaoji Chen AU - Peng Peng AU - Hanbin Liu PY - 2026 JO - ACS Applied Materials & Interfaces DO - 10.1021/acsami.6c13390 UR - https://doi.org/10.1021/acsami.6c13390 ER -
APA
Xiang, H., Ning, L., Bai, Z., Li, Z., Wu, H., Liu, G., Zhou, H., Chen, C., Peng, P., & Liu, H. (2026). Constructing Microstructured Starch Films via Hydrogen Bonding Manipulation for Transient Flexible Electronics. ACS Applied Materials & Interfaces. https://doi.org/10.1021/acsami.6c13390
Source records
- crossref · retrieved 2026-11-07T12:44:24.580Z