A Supramolecular Adhesive with Hierarchical Energy Dissipation for Plywood Applications.

Tian W, Deng J, Zheng J, Zhou Z

DOI: 10.1021/acsami.6c13991
Published: 2026 Sep 23
Container: ACS applied materials & interfaces
Publisher: Not recorded
Open access: no

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Cite this work

BibTeX

@article{allodium:10.1021/acsami.6c13991,
  title = {A Supramolecular Adhesive with Hierarchical Energy Dissipation for Plywood Applications.},
  author = {Tian W and Deng J and Zheng J and Zhou Z},
  year = {2026},
  journal = {ACS applied materials \& interfaces},
  doi = {10.1021/acsami.6c13991},
  url = {https://doi.org/10.1021/acsami.6c13991}
}

RIS

TY  - JOUR
TI  - A Supramolecular Adhesive with Hierarchical Energy Dissipation for Plywood Applications.
AU  - Tian W
AU  - Deng J
AU  - Zheng J
AU  - Zhou Z
PY  - 2026
JO  - ACS applied materials & interfaces
DO  - 10.1021/acsami.6c13991
UR  - https://doi.org/10.1021/acsami.6c13991
ER  -

APA

W, T., J, D., J, Z., & Z, Z. (2026). A Supramolecular Adhesive with Hierarchical Energy Dissipation for Plywood Applications.. ACS applied materials & interfaces. https://doi.org/10.1021/acsami.6c13991

Source records

pubmed · retrieved 2026-11-10T10:44:45.032Z
europe-pmc · retrieved 2026-11-10T10:44:45.083Z