A Supramolecular Adhesive with Hierarchical Energy Dissipation for Plywood Applications

Wei Tian, Jiajia Deng, Jing Zheng, Zhongrong Zhou

Open source

DOI: 10.1021/acsami.6c13991
Published: 2026-09-10
Container: ACS Applied Materials & Interfaces
Publisher: American Chemical Society (ACS)
Open access: unknown

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Cite this work

BibTeX

@article{allodium:10.1021/acsami.6c13991,
  title = {A Supramolecular Adhesive with Hierarchical Energy Dissipation for Plywood Applications},
  author = {Wei Tian and Jiajia Deng and Jing Zheng and Zhongrong Zhou},
  year = {2026},
  journal = {ACS Applied Materials \&amp; Interfaces},
  doi = {10.1021/acsami.6c13991},
  url = {https://doi.org/10.1021/acsami.6c13991}
}

RIS

TY  - JOUR
TI  - A Supramolecular Adhesive with Hierarchical Energy Dissipation for Plywood Applications
AU  - Wei Tian
AU  - Jiajia Deng
AU  - Jing Zheng
AU  - Zhongrong Zhou
PY  - 2026
JO  - ACS Applied Materials &amp; Interfaces
DO  - 10.1021/acsami.6c13991
UR  - https://doi.org/10.1021/acsami.6c13991
ER  -

APA

Tian, W., Deng, J., Zheng, J., & Zhou, Z. (2026). A Supramolecular Adhesive with Hierarchical Energy Dissipation for Plywood Applications. ACS Applied Materials & Interfaces. https://doi.org/10.1021/acsami.6c13991

Source records

crossref · retrieved 2026-09-25T03:54:20.273Z