High-CTE Na3P3O9 Ceramic with Excellent Dielectric Properties Significantly Mitigates Thermal Stress of Solder Joints in RF Systems.
- DOI
- 10.1021/acsami.6c14128
- Published
- 2026 Sep 24
- Container
- ACS applied materials & interfaces
- Publisher
- Not recorded
- Open access
- unknown
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Cite this work
BibTeX
@article{allodium:10.1021/acsami.6c14128,
title = {High-CTE Na3P3O9 Ceramic with Excellent Dielectric Properties Significantly Mitigates Thermal Stress of Solder Joints in RF Systems.},
author = {Bao J and Guo J and Fang Z and Wang ZT and Wang X and Cabot A and Tian D and Zhang CH and Jin BB and Pang LX and Tan KB and Guo Q and Zhou D},
year = {2026},
journal = {ACS applied materials \& interfaces},
doi = {10.1021/acsami.6c14128},
url = {https://doi.org/10.1021/acsami.6c14128}
}RIS
TY - JOUR TI - High-CTE Na3P3O9 Ceramic with Excellent Dielectric Properties Significantly Mitigates Thermal Stress of Solder Joints in RF Systems. AU - Bao J AU - Guo J AU - Fang Z AU - Wang ZT AU - Wang X AU - Cabot A AU - Tian D AU - Zhang CH AU - Jin BB AU - Pang LX AU - Tan KB AU - Guo Q AU - Zhou D PY - 2026 JO - ACS applied materials & interfaces DO - 10.1021/acsami.6c14128 UR - https://doi.org/10.1021/acsami.6c14128 ER -
APA
J, B., J, G., Z, F., ZT, W., X, W., A, C., D, T., CH, Z., BB, J., LX, P., KB, T., Q, G., & D, Z. (2026). High-CTE Na3P3O9 Ceramic with Excellent Dielectric Properties Significantly Mitigates Thermal Stress of Solder Joints in RF Systems.. ACS applied materials & interfaces. https://doi.org/10.1021/acsami.6c14128
Source records
- pubmed · retrieved 2026-09-25T04:36:01.508Z